Electronic module for a hearing device

ABSTRACT

The present disclosure relates to an electronic module for a hearing device. The electronic module comprises at least one electronic component for a hearing device and an embedding material covering the electronic component. The electronic component comprises at least one restricted area which is free from the embedding material. The restricted area is surrounded at least partially by a zone and the zone is covered by an attaching material. The attaching material covering the zone has a mold part formed by molding and freely formed edge facing the restricted area.

CROSS-REFERENCE TO RELATED APPLICATION

This non-provisional application is a Continuation of copendingapplication Ser. No. 17/872,804, filed on Jul. 25, 2022, which is aContinuation of application Ser. No. 17/126,780, filed on Dec. 18, 2020(now U.S. Pat. No. 11,438,718, issued Sep. 6, 2022), which claimspriority under 35 U.S.C. § 119(a) to patent application Ser. No.19/219,180.7 filed in the European Patent Office on Dec. 21, 2019 andpatent application Ser. No. 19/219,179.9 filed in the European PatentOffice on Dec. 21, 2019, all of which are hereby expressly incorporatedby reference into the present application.

FIELD

The present disclosure relates to an electronic module for a hearingdevice. More particularly, the disclosure relates to an electronicmodule for a hearing aid. The present disclosure relates to method ofmanufacturing an electronic module for a hearing device, especially fora hearing aid. Further, the present disclosure relates to a hearing aidcomprising the electronic module according to the present disclosure.

BACKGROUND

In the field of hearing devices, especially hearing aids, one of theissues is protection of hearing device, especially electronic parts ofthe device against dirt and moisture and at the same time making thedevice being resistant to ESD. Moreover, when providing a structure ofthe hearing device, one of issue is size and weight of the hearingdevice. This means that a structure of a device which providesprotection against dirt and moisture and ESD protection, should not leadto increasing size and/or weight of the hearing device. Thus, there is aneed in the field of hearing device field to improve properties of thehearing device without increasing size and/or weight.

In state of the art covering a surface of an electronic element with aprotective and/or insulating material is known as a method for providingprotection of electronic element. However, in known solutions only somesides are covered with the insulation material, thus providing onlypartial protection of an electronic element. This is because electronicelements have some functional parts, like for example microphone port orcontact pad, to which a free access is provided in order to use thefunctional parts for intended purpose. Thus, in state of the art thereis a need to provide an electronic element having only some parts notcovered by insulation material and at the same time providing theremaining surface of an electronic element covered by the protectionmaterial.

Therefore, there is a need to provide a solution that addresses at leastsome of the above-mentioned problems.

SUMMARY

According to an aspect of the disclosure, an electronic module for ahearing device is provided. The electronic module may comprise at leastone electronic component for a hearing device and an embedding materialcovering the electronic component. The electronic component may compriseat least one restricted area which is free from the embedding material.The restricted area may be surrounded at least partially by a zone andthe zone is covered by an attaching material. The attaching materialcovering the zone may have mold part formed by molding and freely formededge facing the restricted area.

The embedding material form a kind of capsule for an electroniccomponent with restricted area which is not covered by an embeddingmaterial. Therefore, the embedding material encapsulates the electroniccomponent. The embedding material provides a protection of a hearingdevice against influence of external environment and at the same timeallows for access to intended parts of the electronic component. This isespecially important in the field of hearing aids. Since the embeddingmaterial covers the electronic component, there is no need to provide aseparate element for protecting the electronic component against dirtand moisture. Since the electronic module comprises a restricted areafree from embedding material, therefore an access to some parts of theelectronic component is provided and the parts can be used in theintended way while the all remaining surface is covered by embeddingmaterial. Since the embedding material covers surface of an electronicmodule excluding a restricted area, a surface of the electroniccomponent covered with the embedding material is protected from moistureand dirt, for example the battery poles. Moreover, the electronic moduleaccording to the disclosure provides improved electrostatic discharge(ESD) performance of a device where the module will be used. This meansthat it is possible to simplify design of the device since less othermeans for ESD protection is needed. In case the electronic modulecomprises more than one component, the embedding material connect thecomponents relative to each other. The embedding material may not onlyconnect components of the electronic module, but also may fix thecomponents with respect to each other. The embedding of the electroniccomponent may be performed for example by encapsulation, molding,transfer molding, injection molding, overmolding, potting and any otherknown methods which allows for covering an object with an embeddingmaterial which is cured or solidified in contact with a component,preferably electronic component. Embedding material is solidifyingmaterial. The solidifying material may be for example epoxy, like forexample silicon, polyurethane, thermoset material or thermoplasticmaterial. The embedding material has preferably at least one of thefollowing properties: low viscosity before solidification, lowshrinkage, is suitable for embedding, UV curing, heat curing, contact toskin, heat conducting, dielectric, transparent, translucent,non-transparent, electrical insulating, electrical conducting, flexible,rigid, low thermal expansion.

Preferably, the embedding material encapsulates the electroniccomponent. This means that excluding the at least one restricted areathe whole surface of the electronic component is covered with theembedding material.

The electronic module may comprise the attaching material is a sealingmaterial.

Using a sealing material allows to use a sealing material having desiredadhesive and sealing properties just for attaching a mask element to anelectronic component.

The electronic module may comprise the attaching material is theembedding material.

When using embedding material as attaching material surface simplifiesthe structure of the module.

The embedding material may form external surface of the electronicmodule and the zone forms at least part of a bottom of a recess in theexternal surface of the encapsulated electronic module.

The embedding material may form the external surface of the electronicmodule.

The recess may be used as a mounting element for a part of a hearingdevice.

The electronic module may comprise the zone is arranged on a protrudingpart of the electronic module.

The electronic module may comprise at least two electronic componentsand the embedding material may attach the components relative to eachother.

The embedding material covers an electronic component and connect thecomponents with respect to each other. The embedding material can fixcomponents with respect to each other. When the components are connectedby the embedding material, the embedding material perform a function ofmounting element, like for example perform a function of a rack.Therefore, a need of providing a rack is eliminated. Moreover, embeddingis especially advantageous for heavy parts of a hearing device becausethe heavy parts are especially exposed to damages when a hearing deviceis for example dropped. Since the embedding material covers the wholesurface of the electronic components the components are attached morestable and a layer of an embedding material perform a function ofprotective element as such. Since embedding provides that electroniccomponents are trapped in the embedding material and the embeddingmaterial fills gaps between the components, no underfill of ICs or otherelectronic parts on PCB needed.

The electronic module may comprise a PCB folded into a three-dimensionalshape so that the PCB suitable for a hearing aid.

The electronic module comprises an element which can be arranged in anydesired way with respect to each other. When the electronic module isfolded into a three-dimensional shape which is suitable for a hearingaid, the arrangement of components of the hearing aid is adjusted to ashape of a hearing device.

According to another aspect, hearing aid comprising the encapsulatedelectronic module according to the disclosure is provided.

Since the electronic component are embedded in the embedding material,the electronic components are protected from dirt and moisture. Thus,there is no need to provide further protection in the hearing device.Moreover, there is no need to provide a rack. The hearing device islighter due to elimination of using a rack and an element providingprotection from dirt and moisture of the electronic component.

According to another aspect, a method of manufacturing an electronicmodule for a hearing device is provided. The method comprises providingat least one electronic component for an electronic module. The methodmay comprise attaching a mask element to the electronic component. Acavity between the mask element and the electronic component may beprovided. The method may comprise embedding the electronic component inan embedding material.

Since a mask element is attached to an electronic component, a surfaceof the electronic component is prevented from being covered withembedding material. A cavity between the mask element and the electroniccomponent provides a capillary stop for the attaching material thuspreventing entering the attaching material to a restricted area andpreventing embedding material from entering the restricted area. Theembedding of the electronic component may be performed for example byencapsulation, molding, transfer molding, injection molding,overmolding, potting and any other known methods which allows forcovering an object with an embedding and/or curable and/or solidifyingmaterial which is cured or solidified in contact with and/or on oraround an electronic component.

The mask element may comprise the cavity.

When a mask element comprises a cavity, the mask element can be usedwith at many types of surfaces of the electronic component. The maskelement can be reused. Moreover, when the mask element is provided witha cavity, the mask element can be feely chosen for every specificapplication matched to shape and type of the electronic component and/orproperties of embedding material and/or features of the electronicmodule we want to obtain.

The electronic component may comprise the cavity.

When a cavity is provided in an electronic component, a mask elementwhich is used in the method does may be flat and therefore improvedpressing the mask element to the electronic component can be achieved.Moreover, when a mask element will be left in an encapsulated electronicmodule after curing, a top surface of the mask element can be even withexternal surface of the encapsulated electronic component formed byencapsulation material.

The attaching may be performed with an attaching substance or attachingmember.

Attaching element or attaching member provides that a mask element isfixed to the electronic component in desired place, namely over arestricted area. Both attaching element or attaching member providesthat the embedding material does not enter to the restricted area.

The attaching may be performed with a sealing material as the attachingmaterial.

The attaching is performed with the encapsulation material as attachingmaterial.

The embedded electronic module may comprise at least two electroniccomponents and the embedding material fix the components relative toeach other.

The method may comprise removing the mask element from the encapsulatedelectronic module.

The restricted area may comprise a protruding part and the methodcomprises sealing the mask element to the protruding part.

The restricted area may comprise a functional element, for examplemicrophone inlet and/or connector and/or switch and/or PCB and/or LEDand/or lightguide and/or speaker outlet and/or an (optical) sensorand/or a skin electrode and/or opening or a serial number sticker.

The method may comprise providing a spring element for decreasing a gapbetween the mask element and the electronic component.

According to another aspect of the disclosure, a method of manufacturingan object embedded in a solidified material and a device for performingthe method are provided.

In the field of methods for covering an object with a material in liquidstate which is solidified afterwards, there is a need to provide amethod which allows removing air form the mold cavity, thus providingmaximized filling of the mold cavity with solidifying and minimizepresence and size of air bubbles present in the material. This isespecially important in applications where an object which need to becovered has complex shape. In such a case there is a risk that airbubbles are trapped somewhere within the object, for example the airbubbles are trapped in a cavity or just in an unevenness of a surface ofan object. This issue is especially important for objects which arecovered with relatively thin layer of a material. In such a case, anissue of avoiding and/or reducing size of air bubbles in embeddingmaterial is important, because in thin layer, an air bubble may causeinterruption of the embedding material. This is especially important forelectronic devices, especially devices comprising electronic componentsand being designed for being used in environment where dirt and moistureis present, like for example hearing devices. In the field of hearingdevices one of the issues is protection of electronic parts of thedevice against dirt and moisture and at the same time making the devicebeing resistant to electro static discharge (ESD). Moreover, whenproviding a structure of the hearing device, especially hearing aid, oneissue is size and weight of the hearing device. This means that astructure of a device which provides protection against dirt andmoisture and ESD protection, should not lead to increasing size and/orweight of the hearing device. Thus, there is a need in the field ofhearing device field to improve properties of the hearing device withoutincreasing size and/or weight.

In state of the art covering a surface of an object with a solidifyingmaterial is known. However, in state of the art there is a need toprovide a method for embedding an object providing minimized amount ofair in embedding material. Therefore, there is a need to provide asolution that addresses at least some of the above-mentioned problems.

According to an aspect of the disclosure a method of manufacturing anobject embedded in a solidified material is provided. The methodcomprises providing an object for embedding in a mold cavity. The moldcavity may have closed volume. The method may comprise initial fillingof the mold cavity and at least one reservoir with a solidifyingmaterial. The method may comprise supplementary filling the mold cavitywith the solidifying material from the at least one reservoir. Themethod may comprise solidifying the solidifying material embedding theobject.

The method according to the disclosure provides that a mold cavity and areservoir of solidifying material are filled with a solidifying materialat the same time. Solidifying material should be understood as amaterial in contact with the object. Solidifying may be performed as areaction or/and phase change, therefore solidifying may be for examplecuring, phase changing, vulcanizing or crosslinking or etc. Initialfilling is first stage of the method and ends when solidifying materialis no longer introduced to the mold cavity and to the reservoir from adispensing system of the solidifying material, for example from anozzle.

Therefore, in the method the solidifying material is supplied to themold cavity and to the reservoir in one operation. During the initialfilling the solidifying material fills the mold cavity and at least onereservoir. Once initial filling is finished, new solidifying materialmay not be supplied by a dispensing system. At this moment the moldcavity comprises solidifying material and air bubbles. The air bubblesmay be released by for example vibration, and/or minimized in size bychanging pressure or changing temperature or a combination of the abovementioned. As result of this releasing and/or shrinking of the airbubbles, a void space/gaps in the mold cavity are created. This voidsspace/gaps are filled by solidifying material form the reservoir duringsupplementary filling.

Since during the initial filling, the solidifying material is collectedin the at least one reservoir, the material may be supplied to the moldcavity from the at least one reservoir. The reservoir may provide accessof the solidifying material to the mold cavity. The method accordingdisclosure allows that filing of the mold cavity may be continued afterthe supplying of solidifying material from dispensing system has ended.

Therefore, no filling means like for example a nozzle is needed duringsupplementary filling. This allows time saving since a solidifyingmaterial for supplementary filling is collected in the reservoir and isready to be used while a nozzle supplying the material may be moved tonext mold cavity. The method according to the disclosure may be pottingmethod, encapsulation method, injection molding method, overmoldingmethod or any other known method which allows to embed an object in asolidifying material which is solidified in contact with the object.

Method according to the disclosure allows control of a geometry of anobject embedded in the solidifying material on all sides, for exampleall six sides, i.e. bottom, left, right, front, back and top of theobject, which is advantageous in compare to known prior art solutions.

The solidifying material for the supplementary filling may be suppliedto the at least one reservoir by an initial filling means.

When solidifying material is supplied the reservoir by the initialfilling means one source of solidifying material are used in the method.

The reservoir can have may have any shape e.g. a thick tube, runner,with an accumulated solidifying material.

The solidifying material may, during the supplementary filling beintroduced to the mold cavity at a point where the solidifying materialis introduced during the initial filling.

A such design would simplify the mold cavity and leave fewer processingmarks on the final part (if the supplementary filling and the initialfilling took place though two different points, it would leave two gateremain marks on the final part—instead of just one.

The supplementary filling may comprise introducing the solidifyingmaterial to the mold cavity at least at one extreme point of the moldcavity, the at least one extreme point is a point in the mold cavitywhich the solidifying material reach during initial filling thuscompleting filling a volume of the mold cavity.

The technical effect of introducing the material at an extreme point isthat the extreme points in a mold is often the hardest ones tofill—either due to the trap air or due to a lack of material flow in thearea (a dead end for the material)—therefore it is a good idea to putthe material introduction point here, since we are then sure that theseextreme points are filled.

In the method there may be provided at least one inspection hole at anextreme point or adjacent to the extreme point, wherein the extremepoint is a point in the mold cavity which the solidifying material reachduring initial filling and thus completing filling a volume of the moldcavity.

The inspection hole may allow visual check of the inside of the moldcavity. Moreover, the inspection hole is also a venting hole. Theinspection hole may also be used as a reservoir (reservoir).

The supplementary filling may be performed at higher pressure than thepressure of the initial filling.

When supplementary filling is performed at higher pressure than initialfilling, for example, the initial filling is performed in a vacuum andthe supplementary filling is performed at atmospheric pressure or above,for example 5 bar or 10 bar, air bubbles entrapped in the cavity moldduring the initial filling are minimized once pressure is increased tothe atmospheric pressure. This is advantageous, since air bubbles areminimized, whereas the presence and size of air bubbles may negativelyaffect performance of the embedded object. Therefore, reduction of sizeof the air bubbles improves performance. The pressure for performinginitial filling or supplementary filling or solidifying may be obtainedby changing a pressure in the mold cavity or by placing the mold cavityin a pressure chamber.

The supplementary filling pressure may be as high as possible above theinitial filling pressure.

Reduction of size of the air bubbles may advantageously affect thevisual appearance of the embedded object, which may be relevant forproducts where an embedded object is not covered with shells.

Reduction of size of the air bubbles may affect the reliability.Especially air bubbles can enable corrosion due to moisture go throughthe air bubbles and lessen structural strength of solidifying material.Reduction of size of the air bubbles reduces the risk of corrosion.

Moreover, air bubbles may furthermore deflect light from entering ofexiting the encapsulated object—e.g. light from an encapsulated LED, orlight to an optical sensor, like e.g. a camera, colour sensor, lightintensity sensor.

The solidifying may be performed at higher pressure than the pressure ofthe initial filling.

The initial filling may be performed in vacuum.

When performing first step, namely initial filling in a vacuum, it ispossible to achieve the biggest possible size difference between the airbubbles while entrapped and the air bubbles while solidification.

The initial filling and/or the supplementary filling may be performedgravitationally.

When the filling is performed gravitationally, amount of energy requiredfor performing the method is minimized.

When the mold cavity is filled gravitationally, this lowers thecomplexity in the filling equipment, since dispensing of the solidifyingmaterial may be continued without a pump after initial filling—therebythere is no need for a precision pump for each mold for the simultaneousfilling and the supplementary filling.

Gravity provides enough to reach the low filling pressures and fillingspeeds which are suitable for embedding the fragile electronics, likeelectronic elements of a hearing aid.

The object may comprise at least one electronic component of a hearingaid.

According to an aspect of the disclosure a device for manufacturing anobject embedded in a solidifying material is provided. The devicecomprises a mold cavity. The device may comprise initial filling meansfor initial filling the mold cavity and at least one reservoir for thesolidifying material. The at least one reservoir may be connected withthe mold cavity for supplementary filling the mold cavity with thesolidifying material.

The device according to the disclosure allows topping up the mold cavityfrom the reservoir. The device allows saving time, since the solidifyingmaterial is supplied to the device, namely to the initial filling meansand the reservoir in one shot. Therefore, after the material is suppliedto the device, the filling means, like for example a nozzle, may bemoved to a next cavity mold.

A device for manufacturing an object embedded in a solidified material,may comprise the at least one reservoir connected with the mold cavityat least at one extreme point of the mold cavity. The at least oneextreme point is a point which the solidifying material reach duringinitial filling and thus completing filling a volume of the mold cavity.

A device for manufacturing an object embedded in a solidified materialmay comprise an opening for inspection and/or for venting the moldcavity at the extreme point or adjacent to the extreme point, the atleast one extreme point is a point in the mold cavity which thesolidifying material reach thus completing filling in the mold cavityduring initial filling.

The opening for venting in the top of the cavity, can also be useddouble as a reservoir—and thereby not leave an excessive amount of markson the final part.

The device may comprise an opening for inspection and/or for venting themold cavity at an extreme point or adjacent to an extreme point, the atleast one extreme point is a point in the mold cavity which thesolidifying material reach thus completing filling a volume of the moldcavity during initial filling.

A device for manufacturing an object embedded in a solidified materialmay comprise an opening for inspection and/or for venting the moldcavity at an extreme point or adjacent to an extreme point, the at leastone extreme point is a point in the mold cavity which the solidifyingmaterial reach thus closing a volume of the mold cavity during initialfilling.

The reservoir may be arranged along a channel for introducing thesolidifying material for the initial filling.

The device may comprise at least one arranged so that the solidifyingmaterial fills the mold cavity gravitationally.

According to some embodiments of the aspect, there is provided:

A method of manufacturing an object embedded in a solidified materialcomprising:

-   -   providing an object for embedding in a mold cavity,    -   the mold cavity is closed volume,    -   initial filling of the mold cavity and at least one reservoir        with a solidifying material,    -   supplementary filling the mold cavity with the solidifying        material from the at least one reservoir,    -   solidifying the solidifying material embedding the object.

A method of manufacturing an object embedded in a solidified materialwherein the solidifying material for the supplementary filling issupplied to the at least one reservoir by an initial filling means.

A method of manufacturing an object embedded in a solidified materialwherein the solidifying material during the supplementary filling isintroduced to the mold cavity at a point where the solidifying materialis introduced during the initial filling.

A method of manufacturing an object embedded in a solidified materialwherein in the supplementary filling comprises introducing thesolidifying material to the mold cavity at least at one extreme point ofthe mold cavity, the at least one extreme point is a point in the moldcavity which the solidifying material reach during initial filling thuscompleting filling the volume of the mold cavity.

A method of manufacturing an object embedded in a solidified materialwherein there is provided at least one inspection hole at an extremepoint or adjacent to the extreme point, wherein the extreme point is apoint in the mold cavity which the solidifying material reach duringinitial filling and thus completing filling a volume of the mold cavity.

A method of manufacturing an object embedded in a solidified materialwherein the supplementary filling is performed at higher pressure thanthe pressure of the initial filling.

A method of manufacturing an object embedded in a solidified materialwherein the solidifying is performed at higher pressure than thepressure of the initial filling.

A method of manufacturing an object embedded in a solidified materialwherein the initial filling is performed in a vacuum.

A method of manufacturing an object embedded in a solidified materialwherein the initial filling and/or the supplementary filling isperformed gravitationally.

A method of manufacturing an object embedded in a solidified materialwherein the object comprises at least one electronic component for ahearing aid.

A device for manufacturing an object embedded in a solidified materialcomprising:

-   -   a mold cavity,    -   initial filling means for initial filling the mold cavity and at        least one reservoir for the solidifying material,    -   the at least one reservoir connected with the mold cavity for        supplementary filling the mold cavity with the solidifying        material.

A device for manufacturing an object embedded in a solidified material,wherein the at least one reservoir is connected with the mold cavity atleast at one extreme point of the mold cavity, the at least one extremepoint is a point which the solidifying material reach during initialfilling and thus completing filling a volume of the mold cavity.

A device for manufacturing an object embedded in a solidified material,comprising an opening for inspection and/or for venting the mold cavityat an extreme point or adjacent to an extreme point, the at least oneextreme point is a point in the mold cavity which the solidifyingmaterial reach thus completing filling a volume of the mold cavityduring initial filling.

A device for manufacturing an object embedded in a solidified materialwherein the reservoir is arranged along a channel for introducing thesolidifying material for the initial filling.

A device for manufacturing an object embedded in a solidified materialwherein the at least one reservoir is arranged so that the solidifyingmaterial fills the mold cavity gravitationally.

BRIEF DESCRIPTION OF DRAWINGS

The aspects of the disclosure may be best understood from the followingdetailed description taken in conjunction with the accompanying figures.The figures are schematic and simplified for clarity, and they just showdetails to improve the understanding of the claims, while other detailsare left out. Throughout, the same reference numerals are used foridentical or corresponding parts. The individual features of each aspectmay each be combined with any or all features of the other aspects.These and other aspects, features and/or technical effect will beapparent from and explained with reference to the illustrationsdescribed hereinafter in which:

FIG. 1 electronic module,

FIG. 2 electronic module,

FIG. 3 top view of restricted area of the electronic module,

FIG. 4 electronic module with a mask element,

FIG. 5 electronic module with a mask element,

FIG. 6 a-f steps of masking with a mask element having a cavity,

FIG. 7 a-f steps of masking with a mask element arranged in a mold,

FIG. 8 a-f steps of masking with a restricted area comprising protrudingpart,

FIG. 9 a device for embedding according to the invention with an objectfor embedding,

FIG. 10 a device for embedding according to the invention with an objectfor embedding,

FIG. 11 a device for embedding according to the invention with an objectfor embedding.

DETAILED DESCRIPTION

The detailed description set forth below in connection with the appendeddrawings is intended as a description of various configurations. Thedetailed description includes specific details for the purpose ofproviding a thorough understanding of various concepts. However, it willbe apparent to those skilled in the art that these concepts may bepracticed without these specific details. Several aspects of theapparatus and methods are described by various blocks, functional units,modules, components, circuits, steps, processes, algorithms, etc.(collectively referred to as “elements”). Depending upon particularapplication, design constraints or other reasons, these elements may beimplemented using electronic hardware, computer program, or anycombination thereof. The electronic hardware may includemicro-electronic-mechanical systems (MEMS), integrated circuits (e.g.application specific), microprocessors, microcontrollers, digital signalprocessors (DSPs), field programmable gate arrays (FPGAs), programmablelogic devices (PLDs), gated logic, discrete hardware circuits, printedcircuit boards (PCB) (e.g. flexible PCBs), and other suitable hardwareconfigured to perform the various functionality described throughoutthis disclosure, e.g. sensors, e.g. for sensing and/or registeringphysical properties of the environment, the device, the user, etc.Computer program shall be construed broadly to mean instructions,instruction sets, code, code segments, program code, programs,subprograms, software modules, applications, software applications,software packages, routines, subroutines, objects, executables, threadsof execution, procedures, functions, etc., whether referred to assoftware, firmware, middleware, microcode, hardware descriptionlanguage, or otherwise.

A hearing device (or hearing instrument, hearing assistance device) maybe or include a hearing aid that is adapted to improve or augment thehearing capability of a user by receiving an acoustic signal from auser's surroundings, generating a corresponding audio signal, possiblymodifying the audio signal and providing the possibly modified audiosignal as an audible signal to at least one of the user's ears.‘Improving or augmenting the hearing capability of a user’ may includecompensating for an individual user's specific hearing loss. The“hearing device” may further refer to a device such as a hearable, anearphone or a headset adapted to receive an audio signal electronically,possibly modifying the audio signal and providing the possibly modifiedaudio signals as an audible signal to at least one of the user's ears.Such audible signals may be provided in the form of an acoustic signalradiated into the user's outer ear, or an acoustic signal transferred asmechanical vibrations to the user's inner ears through bone structure ofthe user's head and/or through parts of the middle ear of the user orelectric signals transferred directly or indirectly to the cochlearnerve and/or to the auditory cortex of the user.

The hearing device is adapted to be worn in any known way. This mayinclude i) arranging a unit of the hearing device behind the ear with atube leading air-borne acoustic signals into the ear canal or with areceiver/loudspeaker arranged close to or in the ear canal and connectedby conductive wires (or wirelessly) to the unit behind the ear, such asin a Behind-the-Ear type hearing aid, and/or ii) arranging the hearingdevice entirely or partly in the pinna and/or in the ear canal of theuser such as in an In-the-Ear type hearing aid orIn-the-Canal/Completely-in-Canal type hearing aid, or iii) arranging aunit of the hearing device attached to a fixture implanted into theskull bone such as in a Bone Anchored Hearing Aid or a Cochlear Implant,or iv) arranging a unit of the hearing device as an entirely or partlyimplanted unit such as in a Bone Anchored Hearing Aid or a CochlearImplant. The hearing device may be implemented in one single unit(housing) or in a number of units individually connected to each other.

A “hearing system” refers to a system comprising one or two hearingdevices, and a “binaural hearing system” refers to a system comprisingtwo hearing devices where the devices are adapted to cooperativelyprovide audible signals to both of the user's ears. The hearing systemor binaural hearing system may further include one or more auxiliarydevice(s) that communicates with at least one hearing device, theauxiliary device affecting the operation of the hearing devices and/orbenefitting from the functioning of the hearing devices. A wired orwireless communication link between the at least one hearing device andthe auxiliary device is established that allows for exchanginginformation (e.g. control and status signals, possibly audio signals)between the at least one hearing device and the auxiliary device. Suchauxiliary devices may include at least one of a remote control, a remotemicrophone, an audio gateway device, a wireless communication device,e.g. a mobile phone (such as a smartphone) or a tablet or anotherdevice, e.g. comprising a graphical interface, a public-address system,a car audio system or a music player, or a combination thereof. Theaudio gateway may be adapted to receive a multitude of audio signalssuch as from an entertainment device like a TV or a music player, atelephone apparatus like a mobile telephone or a computer, e.g. a PC.The auxiliary device may further be adapted to (e.g. allow a user to)select and/or combine an appropriate one of the received audio signals(or combination of signals) for transmission to the at least one hearingdevice. The remote control is adapted to control functionality and/oroperation of the at least one hearing device. The function of the remotecontrol may be implemented in a smartphone or other (e.g. portable)electronic device, the smartphone electronic device possibly running anapplication (APP) that controls functionality of the at least onehearing device.

In general, a hearing device includes i) an input unit such as amicrophone for receiving an acoustic signal from a user's surroundingsand providing a corresponding input audio signal, and/or ii) a receivingunit for electronically receiving an input audio signal. The hearingdevice further includes a signal processing unit for processing theinput audio signal and an output unit for providing an audible signal tothe user in dependence on the processed audio signal.

The input unit may include multiple input microphones, e.g. forproviding direction-dependent audio signal processing. Such directionalmicrophone system is adapted to (relatively) enhance a target acousticsource among a multitude of acoustic sources in the user's environmentand/or to attenuate other sources (e.g. noise). In one aspect, thedirectional system is adapted to detect (such as adaptively detect) fromwhich direction a particular part of the microphone signal originates.This may be achieved by using conventionally known methods. The signalprocessing unit may include an amplifier that is adapted to apply afrequency dependent gain to the input audio signal. The signalprocessing unit may further be adapted to provide other relevantfunctionality such as compression, noise reduction, etc. The output unitmay include an output transducer such as a loudspeaker/receiver forproviding an air-borne acoustic signal transcutaneously orpercutaneously to the skull bone or a vibrator for providing astructure-borne or liquid-borne acoustic signal. In some hearingdevices, the output unit may include one or more output electrodes forproviding the electric signals such as in a Cochlear Implant.

FIG. 1 shows an electronic module 1 for a hearing aid according to thedisclosure. The electronic module comprises electronic components 25.The electronic module shown in FIG. 1 is suitable for behind the earhearing aid. The electronic module shown in FIG. 1 comprises thefollowing electronic components: a microphone, a speaker, a battery, aconnector thus, in this example of the disclosure, the electronic modulecomprises basic components of an exemplary hearing aid. The battery maybe rechargeable or chargeable.

The electronic module 1 shown in FIG. 1 comprises two restricted areas5. The restricted areas 5 are parts of surface of electronic component25 not covered by the embedding material. The restricted areas 5 arefree from embedding material. This allows an access to the electroniccomponent 25. Each restricted area 5 is surrounded by a zone 16 made ofattaching material, which also can be seen in detail in top view in FIG.3 . The zone 16 has a mold part 29 and an edge 27. The edge 27 is a rimof the zone 16 facing the restricted area 5. The mold part 29 is formedby molding. The edge 27 is freely formed by embedding material. Theremaining surface of the module 1 excluding restricted areas 5 iscovered by the embedding material 3. Therefore, only parts of surface ofthe electronic component to which an access is needed are not coveredwith the embedding material 3.

The electronic module 1 according to the disclosure has a layer ofembedding material 3 covering the electronic component 25 excluding therestricted areas 5. The embedding material 3 is preferably solidifyingmaterial, like for example epoxy, like for example silicon,polyurethane, thermoset material or thermoplastic material. Theembedding material has preferably at least one of the followingproperties: is suitable for overmolding, is UV curable, is heat curable,is suitable for contact to skin of a user, is heat conducting, is lowdielectric, is transparent, is translucent. The embedding material maybe liquid.

The embedding material 3 forms an external surface 20 of the electronicmodule 1. Moreover, the embedding material fills gaps, spaces orcavities between and/or in electronic components 25. This is for examplewhen shape or surface of the electronic component 25 is complex or justnot even. Thus, the embedding material forms external shape of theelectronic module 1. The embedding material 3 connects electroniccomponents 25 with each other. Since the components 25 are trapped inthe embedding material 3, the mutual arrangement of the electroniccomponents 25 with respect to each other is established. Depending onproperties of the embedding material 3, there is possibility of relativemovement of the electronic components 25 in extent resulting fromproperties of the embedding material 3 and properties and arrangement ofthe electronic components 25. Since the electronic components 25 arefixed by the embedding material 3, the electronic components 25 aremounted and there is no need to provide a rack in a device for which theelectronic module 1 is intended to use. The component may be fixedlymounted by the embedding material. Moreover, the embedding material 3provides a protection of the electronic components 25 against mechanicaldamages. The mechanical damages are especially harmful for so called“heavy parts”, like a telecoil and/or NFMI coil. Since the embeddingmaterial 3 perform the function of a rack, therefore, there is no needto use a rack in such a hearing device. This means that the material 3provides a structural integrity of the hearing device. When a rack iseliminated, reduction of weight and/or dimensions of a hearing device isachieved.

An example of an electronic component 25 is as shown in FIG. 2 . Theelectronic component 25 can be for example a microphone. The electroniccomponent may be any other component suitable for a hearing device,especially for a hearing aid, like a speaker or PCB or telecoil or nearlink coil or connectors or battery. The electronic module 1 can compriseany combination of the electronic components mentioned above. Moreover,the electronic component may also comprise at least one a non-electroniccomponent.

The electronic module 1 is shaped so that suitable parts of a hearingdevice can be mounted to the electronic module 1. Since the restrictedarea 5 has limited surface, which is adjusted to surface of a partswhich are to be mounted to the restricted area 5, therefore therestricted area 5 is connected with an intended parts of the hearingdevice, thus providing tightness of the device. Since the embeddingmaterial 3 covers the at least one electronic component but without therestricted area 5, the embedding material 3 provides that the at leastone electronic component is protected from moisture and dirt. Moreover,the at least one electronic component 1 when is covered with theembedding material 3, has improved ESD performance.

The electronic module 1 comprises a microphone, a speaker. Theelectronic components of the electronic module 1 shown in FIG. 1 andFIG. 4 comprises a PCB folded into three dimensional shape. The PCB isflex PCB or rigid PCB. The PCB is shaped is such a way that the shape issuitable for a hearing aid.

The restricted area 5 is shown in detail in FIG. 3 . The restricted area5 preferably comprises a functional element 23 of an electroniccomponent 25. The functional element 23 can be for example a microphoneinlet and/or connector and/or switch and/or PCB and/or LED and/orlightguide. The restricted area 5 is large enough for allowing access tothe functional part 23 in order to use the functional element 23 forintended purpose. Moreover, the restricted area 5 as such can be usedfor other purposes, for example for mounting a housing or any otherelement. The functional part 23 is shown in FIG. 3 is for examplemicrophone port or a contact pad. The restricted area 5 is surrounded bya zone 16. The zone 16 is covered by the attaching material. The zone 16has mold part 29 and an edge 27. The mold part 29 is formed by molding.The zone 16 has an edge 27. The edge 27 faces the restricted area 5. Theedge 27 is formed freely by the attaching material. The used term‘freely formed’ means that the edge 27 is formed without contacting withmolding surface acting on the edge 27. This means that the edge 27 isformed by surface tension, viscosity and density of the embeddingmaterial. Therefore, a shape of the edge 27 is often smooth and/orcurved, depending on properties of the embedding material 3. The edge 27is shown in detailed way in cross-section of electronic module 1 shownin FIG. 5 .

The electronic module 1 according to the disclosure is manufactured bythe method according to the disclosure. The method for manufacturingelectronic module 1 for a hearing device comprises providing at leastone electronic component 25 of a hearing device. In order to prevent apart surface of the electronic component 25, called restricted area 5 tobe covered with an embedding material 3, there is performed an attachingof a mask element 8 to the electronic component 25, as shown in detailedway in FIG. 4 .

In order to achieve the electronic module with the restricted area 5, amask element 8 is attached to the electronic component 25 to that themask element 8 covers a part of the surface of the electronic component25. The masked surface comprises an element which needs to be free fromthe embedding material 3. The masked surface comprises for example amicrophone port, a contact pad or any other element. The mask element 8is attached to the electronic component 25 in order to prevent embeddingmaterial 3 to cover at least part of the masked surface called therestricted area 5. The attaching is performed with attaching material,for example with a sealing material, with an embedding material or both.During attaching step the attaching material fills gap between the maskelement 8 and a surface of the masked surface, as shown in FIG. 6 a-6 f. Therefore, the attaching material makes a barrier which preventsembedding material 3 from covering the restricted area 5.

The mask element 8 is shaped so that the mask element 8 provides acapillary stop for attaching material. In order to provide a capillarystop, there is provided a cavity between the mask element 8 and theelectronic component 25. In example shown in detail way in FIG. 5 , thecavity 17 is provided in the mask element 8. When masking step isperformed, the mask element 8 is attached to the electronic component 25so that the cavity 17 faces the electronic component 25. The cavity 17can be provided in the electronic component 25, for example by providinga recess in the electronic component 25. In such a case, a mask elementcan be flat. The attaching of the mask element 8 can be performedtogether with embedding or prior to the embedding. If the attaching isperformed before the embedding, once the mask element 8 is attached tothe electronic component 25, is embedded with the embedding material sothat the whole surface of the electronic component 25, which is notcovered with the at least one mask element 8 is covered with theembedding material 3. The embedding is performed preferably in a mold.The embedding is performed so that the mask element 8 can be removedafter embedding. This means that the mask element 8 is preferably atleast partially not covered with the embedding material 3 or can becovered but in such a way that removal of the mask element 8 ispossible. The mask element 8 can be preferably removed by breaking offthe mask element 8. The removal of the mask element 8 can be alsoperformed by cutting the mask element 8 or dissolving.

The mask element 8 can be part of the electronic module. The maskelement can be left as a part of the electronic module. An opening inthe mask element can be made after embedding is completed thus providingan access to the restricted area 5 arranged below the mask element 8.

The steps of the method for manufacturing electronic module according tothe disclosure are shown in FIG. 6 a-6 f . In the example, theelectronic module comprises an opening 30 in a PCB 31. The opening 30 isa functional element 23 which should not be covered with the embeddingmaterial 3. A part of the surface of the electronic component 25comprising the functional element 23 constitutes the restricted area 5.The opening 30 is for example a MEMS microphone inlet. Once a functionalelement 23 is defined, a mask element 8 is placed over the functionalelement 23. The mask element 8 comprises a cavity 17. The mask element 8is placed on a surface of the electronic component 25 so that the cavity17 faces the functional element 23. The mask element is attached to asurface of the electronic component 25. Preferably, the cavity 17 isarranged substantially centrally opposite the functional element 23. Inshown example the restricted area. has no protruding parts.

Structure of the mask element 8 will be now presented in detail withrespect to FIG. 5 . The mask element 8 has an attaching side 32. Theattaching side 32 is attached to a mask area of the electronic component25. The attaching side 32 is shaped so that the attaching side 32provides a capillary stop for the attaching material. The mask element 8further comprises a top surface 33. The top surface 33 is arrangedsubstantially opposite with respect to the cavity 17. When embeddingstep is performed, the top surface 33 of the mask element 8 ispreferably at least partially free from embedding material 3, to thatthe mask element 8 can be removed after the embedding is performed.After removing the mask element 8, a layer of attaching material whichremains on surface of the electronic component 25 creates the zone 16.

The attaching step is shown in FIG. 6 c . During attaching step, theattaching side 32 is attached to the electronic component 25. Theattaching material seals the mask element 8 to the electronic component25 thus providing preferably tight connection between the mask element 8and the electronic component 25. The attaching material is placedbetween the mask element 8 and a surface of the electronic component 25.The attaching material may be applied after the mask element 8 is placedon the electronic component 25. The attaching material may be placed onthe electronic component 25. The attaching material may be placed on themask element 8. In the example shown, the attaching material can beplaced on the attaching side 32.

Once the mask element 8 is sealed to the electronic component 25 asshown in FIG. 6 c , the electronic component 25 with the mask element 8is placed in the embedding mold 34. The mask element 8 can be used forpositioning the electronic component 25 in the mold 34. For example,only the mask element 8 is in contact with the mold 34 when theelectronic component 25 with the mask element 8 is placed in the mold34. In the example shown in FIG. 6 d-6 f , the mold 34 comprises arecess 35. The recess 35 receives a part of the mask element 8.Preferably, the recess 35 receives at least the top part 33 of the maskelement 8 being terminal part of the mask element 8.

When the electronic component 25 with the mask element 8 is placed inthe mold cavity, the embedding material 3 is introduced into the mold 34thus covering the electronic component 25. Then the mold cavity isfilled with the embedding material 3 and further the embedding material3 is cured. After solidifying, for example curing, the embeddingmaterial 3 with the electronic component 25, the electronic moduleaccording disclosure is achieved. Once the embedding material 3 issolidified, the electronic module 1 can be removed from the mold cavity.

The mold cavity has shape suitable for intended electronic module 1. Theshape of internal space of the mold 34, where the electronic component25 is placed, forms external surface of the electronic module 1.

After solidifying the mask element 8 is removed, thus allowing an accessto the functional element 23 which is not covered by the embeddingmaterial 3. A part of the masked surface which was arranged belowattaching side 32 of the mask element 8 is molded and therefore formsthe mold part 29 of the zone 16 covered by the attaching material. Aninternal rim of the zone 16 forms an edge 27. The edge 27 is formed bythe attaching material which was not molded but was freely formed.

An example of the disclosure is shown in FIG. 7 a-7 f . In this example,a mask element 8 is a part of a mold 34. The mask element 8 protrudesfrom a wall of a mold 34. The mask element 8 has attaching side 32 and acavity 17. The mask element 8 is a part of a mold 34 or is a separatepart which is inserted and mounted in the mold. The attaching side 32 isattached to the masked surface as descried above. Additionally, themethod may comprise using a spring element 36, as shown in FIG. 7 c-7 f. The spring element 36 is placed opposite to the mask element 8 in themold. The spring element 36 press the electronic component 25 to themask element 8 and therefore decreases a distance between the electroniccomponent 25 and the mask element 8. The spring element 36 may be apiece of a foam, a piece of elastomer, a beam sprig, or a spiral springor a combination of above-mentioned elements. Moreover, a wall of themold cavity opposing the mask element 8 can have spring properties thusproviding a function of a spring element 36. The mask element 8 can beeither left in the electronic module 1 after curing the embeddingmaterial 3 or removed. The spring element 36 may be reused when moldingnext electronic component is performed. The spring element 36 can beused also when a mask element 8 is not a part of a mold 34.

An example of the disclosure is shown in FIG. 8 a-8 f . In this examplea functional element 23 has a protruding part 18. In FIG. 8 b the maskelement 8 is attached to the protruding part 18, as shown in FIG. 8 b .In FIG. 8 a-8 f the protruding part 18 is a connector. The mask element8 is placed the protruding part 18 so that an attaching surface 32 ofthe mask element 8 abuts the protruding part 18. The mask element issealed to the protruding part 18. The mask element 8 forms a cap aroundthe protruding part 18. The mask element 8 is attached to the protrudingpart 18 by an attaching material. Additionally, a spring element can beprovided in order to decrease a gap between the mask element 8 and theprotruding part 18 of the electronic component 25.

When the mask element 8 is attached to the protruding part 18, the zone16 can be formed on the protruding part 18 as shown in detail in FIG. 8f . The zone 16 is a layer of attaching material which remains onsurface of the electronic component 25 after removing the mask element8. The zone 16 can be covered with a layer or the attaching materialwhich is thinner than a layer of the embedding material 3 covering theremaining surface of the electronic component 25. The zone 16 has anedge 27 facing the restricted area 5. In this example, the restrictedarea 5 comprises the protruding part 18.

FIG. 9 shows an object 100 for embedding which is in this case anelectronic module for a hearing aid comprising an electronic component.The electronic module shown in FIG. 9 is suitable for behind the earhearing aid. However, the object may be an electronic component for anytype of hearing aid, like for example in the ear hearing aid. Theelectronic module shown in FIG. 9 comprises a microphone, a speaker, abattery, a connector. Thus, in this example of the invention, the object100 for embedding comprises an electronic components of an a hearingaid. Moreover, an object for embedding may be any comprise at least oneelectronic and/or non-electronic component. Thus, it is possible toencapsulate the whole electronics of a hearing aid using the methodaccording to the disclosure.

Embedding material is solidifying material. The solidifying material maybe for example epoxy, like for example silicon, polyurethane, thermosetmaterial or thermoplastic material. The embedding material haspreferably at least one of the following properties: low viscositybefore solidification, low shrinkage, is suitable for embedding, UVcuring, heat curing, contact to skin, heat conducting, dielectric,transparent, translucent, non-transparent, electrical insulating,electrical conducting, flexible, rigid, low thermal expansion.

FIG. 9 shows an object 100 for embedding placed in a mold cavity 200.The object 100 is placed in the mold cavity 200 and the mold cavity isclosed in order to provide a closed volume of the mold cavity 200. Whenthe volume of the mold cavity 200 is closed, a material for embedding isintroduced to the volume of the mold cavity 200 and to the reservoir Aand B thus performing initial filling of the mold cavity 200 and thereservoir A and B with the solidifying material. The initial filling ofthe mold cavity 200 is preferably performed up to the moment when themold cavity 200 is filled with the solidifying material. The inlet 600of the solidifying material to the mold cavity 200 is preferablyarranged so that the solidifying material during filling the mold cavity200 force out air bubbles which are present in the mold cavity 200. InFIG. 9 inlet 600 of the solidifying material in located at the lowestpossible point in the object the object 100 for solidifying. This makegravity/buoyancy of the entrapped air bobbles assist in forcing out theair though the top of the cavity.

During the initial filling of the mold cavity 200 and the reservoir s A,B are filled substantially simultaneously, which means that a part ofthe amount of the solidifying material is collected in the reservoir A,B. This solidifying material collected in the reservoir A, B is intendedfor use in supplementary filling of the mold cavity 200 after theinitial filling is finished. The initial filling is performed using theinitial filling means comprising for example a nozzle for providing thesolidifying material. Preferably after the initial filling is finished,the initial filling means are moved to next mold cavity. However, theinitial filling means ca be moved to next mold cavity even if the moldcavity is completely filled with the solidifying material. Thesolidifying material comprises air bubbles, which means the solidifyingmaterial which is introduced to the mold cavity 200 is a mix of thematerial and air bubbles. After the initial filling is finished, the airbubbles which are present in the mold cavity 200 are released or volumewise reduced, so free space/gaps are created inside the mold cavity 200.The air bubbles may be release by vibration, changing temperature,changing pressure or any combinations of the above mentioned factors.The solidifying material for supplementary filling is provided and freevolume/space which appears in the mold cavity 200 is be filled withoutusing the initial filling means. The reservoir A, B shown in FIG. 9 isconnected with the mold cavity 200 and ensures the availability of extrasolidifying material to fill the space/voids.

This allows saving time of using initial filling means and at the sametime provides that the mold cavity 200 is fulfilled with the solidifyingmaterial when free spaces/gaps are being created. After supplementaryfilling is completed, the solidifying material is solidified.

The free space in the cavity mold 200 may be created as result ofreleasing the air bubbles. The free space may be created as result ofvolume wise reduced of the air bubbles. Volume wise reducing of airbubbles may be result of pressure difference between the initial fillingand the supplementary filling and/or initial filling and solidifyingstage. For example, the initial filling may be performed in vacuum, forexample in a vacuum chamber. After the initial filling is completed, thevacuum may be released. When the vacuum is released, the air bubblesshrink in size since the pressure inside the air bubbles increases fromthe vacuum to atmospheric pressure.

In FIG. 9 the reservoir A is arranged along a canal 500 for supplyingmaterial for initial filling to the mold cavity 200. In this case, thereservoir A is a reservoir placed along the canal 500. However, thereservoir may be smooth widening of the canal 500. Second reservoir Bmay be arranged for example substantially opposite to the inlet 600 ofthe canal 500 to the mold cavity 200. Preferably, the second reservoir Bis arranged at an extreme point of the mold cavity. The extreme point isa point in the mold cavity which the solidifying material reach thuscompleting filling of the mold cavity 200 with the solidifying material.Close to the extreme point or adjacent to the extreme point or in theextreme point an inspection hole and/or venting point may be provided.

The at least one reservoir A,B,C may be arranged so that the solidifyingmaterial enters the mold cavity gravitationally. However, thesolidifying material may be introduced under pressure.

When cavity mold 500 is more complex, as shown in FIG. 11 the deviceaccording to the disclosure may comprise more than one extreme point 300as defined above. The device according to the disclosure shown in FIG.11 has two reservoirs connected to the extreme points: reservoir B andreservoir C.

The device according the disclosure may comprise one reservoir for morethan one mold cavity 200. In FIG. 10 , the reservoir A is arranged alonga canal 500 which supplies solidifying material to two mold cavities200, 200′. In each mold cavity 200,200′, is arranged an object 100,100′, respectively.

The present disclosure relates also to a method where no supplementaryfilling is performed. In such a case one filling of the mold cavity 200with solidifying material is performed. The filling is performed undervacuum, for example in a vacuum chamber, with an absolute pressure ofe.g. between 0.1 mBar and 1 Bar and fill, for example via gravity orunder a pressure below 50 bar with solidifying material. The vacuum isto minimize the presence of air molecules in the cavity entrapping airin bubbles during the filling process. When the vacuum is released, thebubbles will shrink in size. The solidifying can take place in apressure higher than atmospheric, to squeeze the entrapped air bubblesto an even higher level making the bubbles smaller.

1. A hearing instrument comprising an electronic module comprising: asubstrate; a plurality of electric components located on the substrate;a plurality of restricted areas, wherein each of the plurality ofrestricted areas is configured to provide an access location to afunctional part of one of the plurality of electronic components; and aplurality of attachment material zones, each of the plurality ofattachment material zones at least partially surrounding one of theplurality of restricted areas; attachment material located on theattachment zone, wherein the attachment material is configured to attachto a masking material; and embedding material forming an external shapeof the electronic module, wherein the restricted area is free from theembedding material, and wherein the embedding material at leastpartially covers the plurality of electronic components.
 2. The hearinginstrument of claim 1, wherein the embedding material is configured tofix the plurality of electronic components to the substrate
 3. Thehearing instrument of claim 1, wherein the embedding material isconfigured to allow for relative movement of one or more of theplurality of electronic components.
 4. The hearing instrument of claim1, wherein the substrate is a printed circuit board (PCB).
 5. Thehearing instrument of claim 1, wherein the access location is one ormore of a port, a microphone inlet, a connector, a switch, a PCB, anLED, and a lightguide.
 6. The hearing instrument of claim 1, wherein theaccess location is a protrusion of one of the plurality of electroniccomponents.
 7. The hearing instrument of claim 1, wherein the attachmentmaterial zone comprises a curved edge forming a boundary with each ofthe plurality of restricted areas.
 8. The hearing instrument of claim 1,wherein the attachment material zone comprises a tapering edge forming aboundary with each of the plurality of restricted areas.
 9. The hearinginstrument of claim 1, wherein the attachment material is configured toact as a capillary stop for the attachment material.
 10. The hearinginstrument of claim 1, wherein embedding material is an epoxy.
 11. Thehearing instrument of claim 8, wherein embedding material comprisessilicon or polyurethane.
 12. The hearing instrument of claim 1, whereinembedding material is a UV curable material.
 13. The hearing instrumentof claim 1, wherein the electronic module does not include a rack. 14.The hearing instrument of claim 1, wherein the electronic modulecomprises a plurality of surfaces, and wherein the embedding material islocated on at least two of the plurality of surfaces.
 15. The hearinginstrument of claim 1, wherein each of the plurality of attachmentmaterial zones fully surrounds one of the plurality of restricted areas.16. The hearing instrument of claim 1, wherein the embedding materialextends away from the substrate farther than the attachment materialextends from the substrate.
 17. The hearing instrument of claim 1,wherein the embedding material fully covers the plurality of electroniccomponents outside of the restricted areas and the plurality ofattachment material zones.
 18. The hearing instrument of claim 1,wherein the plurality of attachment material zones are free from theembedding material.